Testing Capabilities
Our experimental testing capabilities include a complete set of equipment for magnetic sensor chip design and manufacturing, such as ultra-high vacuum magnetron sputtering systems, vacuum magnetic annealing furnaces, photolithography machines, etching machines, automatic probe stations, and chip sorting machines. We conduct magnetic sensor chip R&D and mass production based on a 4-8 inch MEMS platform.
Fully Autonomous Magnetoresistive Chip Processing Capabilities:
Edge profile control of junction areas
Insulation via hole technology
Single-chip full-bridge technology
We possess a complete set of AMR, GMR, and TMR chip design and manufacturing technologies, including a full magnetoresistive sensor chip production line:
Sensitive Material Sputtering System
Material Performance Testing System (CIPT)
Magnetic Field Annealing Furnace System
Wafer Processing Workshop
Wafer Testing System
Chip Testing System
Features: High Precision、Wide Bandwidth、Low Temperature Drift、Fully Autonomous Control