Aircraft SSPC Wickway - Fault free operation 20000h
Solid state power controller（SSPC）It is a key component in the development of electric aircraft and must be compact, responsive, and highly reliable. The development of silicon carbide (SiC) semiconductor switches has provided a series of improvements for SSPC in terms of electrical and thermal performance. In the proposed SSPC design, SiC MOSFET chips are installed on cast aluminum traces, with an aluminum nitride (AlN) layer and an aluminum composite substrate underneath. Discussed the concept of i2t and its application in solid-state protection. The transient thermal characteristics of SiC MOSFET were provided on this almost all aluminum package through finite element analysis (FEA). Combined with electrical experiments, the key transient thermal performance of 320Vdc SSPC with a nominal fault of 120A/1200A designed for a transient junction temperature of 350 ° C has been demonstrated.
The increasing trend of electric aircraft (MEA) and all electric aircraft (AEA) is driving higher demands for high-performance power electronic systems [1-8]. Among them, solid-state power controllers（SSPC）Replacing traditional mechanical circuit breakers with smaller, lighter, faster, and more reliable switches has played an important role in development [9-13]. Although silicon-based SSPCs are currently available in the market for aircraft, their application is limited to secondary power distribution systems due to their relatively low rated power and high power loss. The inherent advantages of SiC based SSPC provide lower on resistance, higher breakdown voltage and thermal conductivity, as well as closer thermal expansion coefficient and better mechanical properties. The first two advantages greatly improve the rated power and density of SiC SSPC. The last three have higher reliability at higher transient junction temperatures (>350 ° C), therefore higher transient power transfer capabilities can be used. In addition, all performance enhancements can be achieved without expanding the size and weight of the controller.
Content reference: 2011 Twenty Sixth Annual IEEE