Time： 2024-08-18
韋克威科技
Reliability and Failure Analysis of Electronic Components (II)
Manufacturing process and defects of electronic components1. Defects and yield prediction in chip processingClassification of chip manufacturing defects:IC process:Oxidation, diffusion, coating, photolithography, etc
Thick film process:Substrate processing, plate making, screen printing, sintering, laser resistance adjustment, separation of component assembly, etc
Thin film process:Substrate processing, plate making, thin film preparation, photolithography, electroplating, etc
Interconnection failure: 23%, wire bonding failure, poor chip bonding, etcRegarding hybrid integrated circuits:According to the manufacturing process, integrated circuits can be divided into:(1) Semiconductor integrated circuit (substrate: semiconductor) Namely: Single chip integrated circuit (solid-state circuit) Process: Semiconductor process (diffusion, oxidation, epitaxy, etc.)(2) Membrane integrated circuit (substrate: glass, ceramic, etc. insulator) Thin film integrated circuits - vacuum evaporation, sputtering, chemical vapor deposition technology Thick film integrated circuits - coated with paste on a substrate and sintered (screen printing technology)3. Hybrid Integrated CircuitCharacteristics: Fully utilize the advantages of semiconductor integrated circuits and membrane integrated circuits to achieve complementary advantages;Process: Passive components are made using film technology, and active devices are made using semiconductor ICs or transistors.Comparison of three types of integrated circuits:
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